Latest Product News
IHLP Inductors – Low Profile and High Current Inductors
Earlier in the month of September, Vishay Intertechnology extended a new family of inductors called the IHLP Inductors. These Inductors have a low DCR value and high current…
MAX86150 – Integrated Electrocardiogram (ECG) and Photoplethysmogram (PPG) Bio-Sensor for mobile health monitoring
Maximum Integrated has launched a new bio-sensor which can measure both PPG and ECG as a single package. This sensor is aimed to be used in portable mobile devices like Smart…
IEWS20R5135IPB – Protected IGBT with built-in driver IC for Induction Heating Applications
Infineon Technologies has launched the new F-Series Protected IGBTs with TRENCHSTOP feature. This new IGBT includes built-in logic functionality and a dedicated driver IC which is…
Lakefield Chip – A 10 Nano Meter Processor from Intel
During the 2019 CES conference Intel has demonstrated its new ultra compact 10nm Processor called the Lakefield. These processors consists of a hybrid CPU that packs in a 10nm…
BM14270MUV-LB Ultra-compact contactless current sensor for industrial equipment and consumer devices
With a form factor of only 3.5mm square ROHM semiconductors has launched a new contact less current sensor for high power applications like servers in data centers and solar power…
PI4ULS5V108 – 8-bit Bidirectional Level shifter for inter-IC communication operating on different voltages
Diodes Incorporated has today launched a new 8 channel high speed bidirectional level shifter for Open-Drain and Push-pull applications. This new IC called PL4UL5V108 is designed…
TC78H653FTG – Low Voltage, high current dual H-Bridge Driver IC for Brushed DC Motors and Stepper Motors
Focused to be used in battery operated low voltage equipments like mobile devices, USB drivers and other portable home electronic products Toshiba Electronic Devices has launched…
SLM97 – Miniaturized industrial-grade eSIM for M2M applications
With a dimension of only 2.5mm×2.7mm, Infineon Technologies has launched an industrial-grade embedded SIM (eSIM) in a Wafer-level- Chip-scale Package (WLCSP) which it claims to be…
Micro Lock Plus – Wire to Board connectors for high temperature automotive and industrial applications
To provide reliable electrical and mechanical performance in a compact high temperature environment, Molex has designed a new Wire-to-Board connector called the Micro-Lock Plus.…