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Aerospace

Thin Film Wraparound Chip Resistor
Thin Film Wraparound Chip Resistor

High Precision Thin Film Wraparound Chip Resistor offers Wide Resistance Range for Military and Aerospace Applications

Vishay Intertechnology, Inc. has introduced a new high precision thin film wraparound chip resistor that delivers higher power ratings in smaller case sizes and is designed for industrial, military, and aerospace applications.
Space Splice 4 Way Connector Series
Space Splice 4 Way Connector Series

Space Splice 4 Way High Reliability Connector Series for Aerospace Applications

C&K has developed the Space Splice 4 Ways series High Reliability Connectors which are ideal for applications in aerospace systems, specifically
Dura-Con Micro-D Top Entry EMI Backshells
Dura-Con Micro-D Top Entry EMI Backshells

Nickel and Cadmium Plated Dura-Con Micro-D Top Entry EMI Backshells for Enhancing Mechanical and Electrical Durability

The Dura-Con Micro-D Top Entry EMI Backshells from Cinch Connectivity Solutions is available in both plug and socket configurations for eight standard micro-d sizes.
High-Power Broadband RF and Microwave PIN Diode Series from Fairview Microwave
High-Power Broadband RF and Microwave PIN Diode Series from Fairview Microwave

GaN Semiconductor Technology-Based High Power RF and Microwave PIN Diodes for Aerospace and Military Applications

Fairview Microwave has released the new high-power broadband RF and microwave PIN diode series that utilizes GaN semiconductor technology for ensuring state-of-the-art power performance with an excellent power-to-volume ratio.
Radiation-Hardened M6 MRH25N12U3 MOSFET
Radiation-Hardened M6 MRH25N12U3 MOSFET

Radiation Hardened M6 MRH25N12U3 MOSFET to Withstand Solar and Electromagnetic Events in Aerospace Applications

Microchip Technology has introduced the M6 MRH25N12U3 radiation-hardened 250V, 0.21 Ohm Rds(on), MOSFET for the operation against extreme particle interactions and solar and electromagnetic events in commercial aerospace and defense space applications.
Microchip's DesignShield Development Tool
Microchip's DesignShield Development Tool

DesignShield Development Tool to Provide Security in Aerospace, Defense and High-Assurance Systems

Microchip has introduced a new DesignShield development tool that prevents malicious extraction of Critical Program Information (CPI) via FPGAs.
3-Phase SiC MOSFET Intelligent Power Module (IPM)
3-Phase SiC MOSFET Intelligent Power Module (IPM)

Liquid Cooled 3-Phase SiC MOSFET Intelligent Power Module (IPM) for High Efficiency and Power Density in E-mobility and Aerospace Applications

CISSOID has added new liquid-cooled modules to its growing platform of 3-Phase Silicon Carbide (SiC) MOSFET Intelligent Power Module (IPM) products for E-mobility tailored for lower switching losses or higher power.
ADQUADMXFE1EBZ 16-Channel Mixed-Signal Front-End Digitizer
Quad MxFE Development Platform

ADQUADMXFE1EBZ 16-Channel Mixed-Signal Front-End Digitizer for Reference Design Integration

Analog Devices has introduced the 16-channel, mixed-signal front-end (MxFE) digitizer that includes four AD9081 or four AD9082 software-defined, direct RF sampling transceivers.
VJ....32 Lead Bearing Finish MLCC
VJ....32 Lead Bearing Finish MLCC

Surface Mount Multilayer Ceramic Chip Capacitors with Minimum Lead (Pb) Content for Cost-Sensitive Aerospace Applications

Vishay Intertechnology has introduced a new series of surface-mount multilayer ceramic chip capacitors (MLCCs) with a lead (Pb)-bearing termination finish.