New MOSFET and Diode Power Modules in EMIPAK 1B Offer a Complete Solution for On-Board Charging Applications
Vishay Intertechnology, Inc. has introduced seven new MOSFET and diode power modules that offer a variety of circuit configurations and combine high efficiency fast body diode MOSFETs and SiC, FRED Pt, and MOAT diode technologies in the compact EMIPAK 1B package featuring patented PressFit pin locking technology. These modules are designed specifically for on-board charger applications and combined to provide a complete solution for electric (EV) and hybrid electric (HEV) vehicles, in addition to e-scooters, agricultural equipment, and railways.
Based on a matrix approach, the devices’ EMIPAK package can accommodate a range of custom circuit configurations in the same compact 63 mm by 34 mm by 12 footprint. This enables higher power density than utilizing discrete solutions while providing the flexibility to use each module in different power stages for industrial and renewable energy applications, including welding, plasma cutting, UPS, solar inverters, and wind turbines.
The devices’ exposed AI2O3 direct bonded copper (DBC) substrate provides improved thermal performance, while their optimized layout helps to minimize stray inductance for better EMI performance. The modules’ PressFit pin locking technology allows for easy PCB mounting and reduces mechanical stress on the substrate, while their baseless structure increases reliability by reducing the number of solder interfaces.