MAX77540 Converter: Step-Down Buck Converter Features 94% Peak Efficiency and Provides Single Stage Power Conversion in Multi-Cell Battery Applications
Analog Devices, Inc. has introduced the new MAX77540 step-down buck converter that provides single-stage power conversion in multi-cell battery applications, such as augmented reality/virtual reality (ARVR) headsets, land mobile radios (LMRs), and digital single-lens reflex (DSLR) cameras. The power-dense MAX77540 buck converter features 94 percent peak efficiency and wafer-level packaging that measures 61 percent smaller than traditional quad flat no-lead packages. Moreover, with a wide input voltage range, it enables a direct conversion for sub-1V outputs from 3-cell Li+ batteries, USB PD, and 12VDC supply rails.
This new converter uses an adaptive COT (constant on-time) current-mode control architecture and the two 3A switching phases can be configured as either one (2Φ, 6A) or two (1Φ, 3A each) outputs. Default power-on configuration only requires two external resistors, and an I2C interface allows further control for advanced power management techniques. External frequency tracking and spread spectrum modulation provide low electromagnetic interference (EMI) power conversions for data sensing and processing equipment.
Features
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4V to 16V Input Voltage Range
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0.5V to 5.2V Output Voltage Range
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Resistor Configurable Default VOUT
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Two 3A Bucks (1Φ) or One 6A Buck (2Φ)
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±0.5% VOUT Accuracy (Default VOUT at 25°C)
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94% Peak Efficiency (7.6VIN, 3.3VOUT, 1MHz)
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Auto SKIP/PWM and Low-Power Mode
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98% Max. Duty Cycle Dropout Operation
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Programmable Soft-Start/Stop and Ramp-Up/Down Slew Rates
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Pre-Biased Startup and Active Output Discharge
Applications
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2/3-Cell Li+ and USB-C Power Delivery Systems
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Audio and Video Equipment
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Microprocessors, field-programmable gate arrays (FPGAs), digital signal processors (DSPs), and application-specific integrated circuits (ASICs)
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Networking and PCIe®/redundant array of inexpensive disks (RAID) Cards
Availability
The MAX7750 step-down buck converter is now available in a 2.51mm x 2.31mm 30-bump wafer-level package (WLP).
