Leadless NTC Thermistor Dies with Versatile Mounting Options optimized for Temperature Sensing in Automotive and Alternative Energy Applications

Vishay Intertechnology, Inc. has introduced a new series of leadless NTC thermistor dies that provides designers with versatile mounting options and is compatible with reflow soldering under vacuum or with formic acid / forming gasses, SAC or SMP soldering, and nano-silver paste sintering. The new NTCC201E4 devices with silver metallization support aluminum wire bonding and are optimized for temperature sensing, control, and compensation in automotive and alternative energy applications. End products will include IGBT and power MOSFET modules and power inverters for electric (EV) and hybrid electric vehicles (HEV), solar panels, and wind turbines.

Operating over a wide temperature range from -55 °C to +175 °C, these AEC-Q200 qualified devices offer resistance at +25°C (R25) from 4.7 kΩ to 20 kΩ, with tolerance down to ± 1 %, and beta (B25/85) from 3435 K to 3865 K, with tolerance down to ± 1 %. These devices feature maximum power dissipation of 50 mW, response times of 3 s, and are packaged in PS blister tape. The top and bottom metallization of these thermistors feature two layers. An external layer offers superior resistance to soldering leaching compared to previous-generation devices, especially when using high melting point solder materials at temperatures of +360 °C and an internal layer resists board formic acid etching when solder preforms are used and forming H2 / N2 gasses.

Features

• Flat chip contacted top and bottom (NTCC201E4 series)

• Green thermistor - does not use RoHS exemptions

• Wide temperature range from -55 °C to +175 °C (resistant to repetitive short periods at 200 °C, as for example, 10 times 10 s)

• Highly resistant to mounting conditions

• Ideal for aluminum wire

• Resistance to leaching during reflow soldering process

• Delivered on blister tape

• AEC-Q200 qualified

Applications

• High temperature sensing, control and compensation in power semiconductor modules (e.g. IGBT, MOSFET, Diode), inverters in EV/HEV vehicles, and windmills

• IC and semiconductor protecting

• DC/AC power inverters and HIC overheat protecting