High Performance NFC Forum Reader Devices with Noise Suppression Receiver designed for Payment, Consumer and Industrial Applications

STMicroelectronics has announced two new NFC Forum Reader devices ST25R3916B-AQWT and ST25R3917B-AQWT that support NFC initiator, target, reader, and card-emulation modes and can be used in contactless payment, device-pairing, wireless-charging, brand protection, and other industrial and consumer applications. These ICs offer a wide power-supply voltage range, from as low as 2.4V to 5.5V, and operating temperatures from -40°C to 105°C. These new devices introduce improved active wave shaping (AWS) with increased flexibility that simplifies the adjustment of the RF output to optimize overshoot and undershoot. Moreover, both devices offer a high level of resistance to both radiated noise and conducted noise.

These devices deliver up to 1.6W RF output power and can drive antennas directly at high efficiency. Dynamic power-output (DPO) adjustment enables designers to keep the radiated power between the upper and lower limits defined by EMVCo and the NFC Forum specifications. Combining a highly noise-resistant input structure and noise-suppression receivers (NSR), these devices have high immunity to interference from other nearby equipment such as power supplies and POS terminals.

Features

• Dynamic power output (DPO) controls the field strength to stay within given limits

• Active wave shaping (AWS) reduces over-and under-shoots

• Noise suppression receiver (NSR) allows reception in noisy environment

• Automatic antenna tuning (AAT) via variable capacitor

• Integrated EMVCo® 3.1a compliant EMD handling

• Automatic gain control and squelch feature to maximize SNR

• Low power NFC active and passive target modes

• Adjustable ASK modulation depth, from 0 to 82%

• Integrated regulators to boost system PSRR

Applications

• Contactless-payment

• Device-pairing

• Wireless-charging

• Brand protection

• Industrial applications

• Consumer applications

Availability

Free samples of these devices are now available on ST eStore in 32-lead VFQFPN 5mm x 5mm x 1mm package and 36-bump wafer-level chip-scale package (WLCSP) options.