ESP32-PICO-D4 Wireless SIP

ESP32-PICO-D4 is an ESP32-based System-in-Package (SIP) from Espressif. The new ESP32-PICO-D4 SIP combines an ESP32 SoC, crystal oscillator, filter capacitors, RF matching links, and 4MB flash, into a single 7mm × 7mm QFN package. Including the passive components in the design means that the new QFN package needs very little external support to be used on our own PCB. With its ultra-small size, robust performance, and low-energy consumption, ESP32-PICO-D4 is well suited for any space-limited or battery-operated applications, such as wearable electronics, medical equipment, sensors, and other IoT products.

 

ESP32-PICO-D4 Pinout Configuration

No.	Name	Type	Function
1	VDDA	P	Analog Power Supply (2.3V ~ 3.6V)
2	LNA_IN	I/O	RF Input and Output
3	VDDA3P3	P	Analog power supply (2.3 V ~ 3.6 V)
4	VDDA3P3	P	Analog power supply (2.3 V ~ 3.6 V)
5	SENSOR_VP	I	GPIO36, ADC1_CH0, RTC_GPIO0
6	SENSOR_CAPP	I	GPIO37, ADC1_CH1, RTC_GPIO1
7	SENSOR_CAPN	I	GPIO38, ADC1_CH2, RTC_GPIO2
8	SENSOR_VN	I	GPIO39, ADC1_CH3, RTC_GPIO3
9	EN	I	High: On; enables the module Low: Off; the module powers off Note: Do not leave this pin floating.
10	IO34	I	GPIO34, ADC1_CH6, RTC_GPIO4
11	IO35	I	GPIO35, ADC1_CH7, RTC_GPIO5
12	IO32	I/O	GPIO32, 32K_XP (32.768 kHz crystal oscillator input), ADC1_CH4, TOUCH9, RTC_GPIO9
13	IO33	I/O	GPIO33, 32K_XN (32.768 kHz crystal oscillator output), ADC1_CH5, TOUCH8, RTC_GPIO8
14	IO25	I/O	GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0
15	IO26	I/O	GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1
16	IO27	I/O	GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV
17	IO14	I/O	GPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK, SD_CLK, EMAC_TXD2
18	IO12	I/O	GPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ, HS2_DATA2, SD_DATA2, EMAC_TXD3
19	VDD3P3_RTC	P	Input power supply for RTC IO (3.0 V ~ 3.6 V)
20	IO13	I/O	GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, HS2_DATA3, SD_DATA3, EMAC_RX_ER
21	IO15	I/O	GPIO15, ADC2_CH3, TOUCH3, RTC_GPIO13, MTDO, HSPICS0, HS2_CMD, SD_CMD, EMAC_RXD3
22	IO2	I/O	GPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0, SD_DATA0
23	IO0	I/O	GPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1, EMAC_TX_CLK
24	IO4	I/O	GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1, SD_DATA1, EMAC_TX_ER
25	IO16	I/O	GPIO16, HS1_DATA4, U2RXD, EMAC_CLK_OUT
26	VDD_SDIO	P	Output power supply.
27	IO17	I/O	GPIO17, HS1_DATA5, U2TXD, EMAC_CLK_OUT_180
28	SD2	I/O	GPIO9, SD_DATA2, SPIHD, HS1_DATA2, U1RXD
29	SD3	I/O	GPIO10, SD_DATA3, SPIWP, HS1_DATA3, U1TXD
30	CMD	I/O	GPIO11, SD_CMD, SPICS0, HS1_CMD, U1RTS
31	CLK	I/O	GPIO6, SD_CLK, SPICLK, HS1_CLK, U1CTS
32	SD0	I/O	GPIO7, SD_DATA0, SPIQ, HS1_DATA0, U2RTS
33	SD1	I/O	GPIO8, SD_DATA1, SPID, HS1_DATA1, U2CTS
34	IO5	I/O	GPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK
35	IO18	I/O	GPIO18, VSPICLK, HS1_DATA7
36	IO23	I/O	GPIO23, VSPID, HS1_STROBE
37	VDD3P3_CPU	P	Input power supply for CPU IO (1.8 V ~ 3.6 V)
38	IO19	I/O	GPIO19, VSPIQ, U0CTS, EMAC_TXD0
39	IO22	I/O	GPIO22, VSPIWP, U0RTS, EMAC_TXD1
40	U0RXD	I/O	GPIO3, U0RXD, CLK_OUT2
41	U0TXD	I/O	GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2
42	IO21	I/O	GPIO21, VSPIHD, EMAC_TX_EN
43	VDDA	P	Analog power supply (2.3 V ~ 3.6 V)
44	XTAL_N_NC	-	NC
45	XTAL_P_NC	-	NC
46	VDDA	P	Analog power supply (2.3 V ~ 3.6 V)
47	CAP2_NC	-	NC
48	CAP1_NC	-	NC

 

ESP32-PICO-D4 Features and Specifications

MCU

• ESP32 embedded, Xtensa® dual-core 32-bit LX6 microprocessor, up to 240 MHz
• 448 KBROMfor booting and core functions
• 520 KBSRAMfor data and instructions
• 16KBSRAMinRTC

Wi-Fi

• 802.11 b/g/n
• Bit rate: 802.11n up to 150 Mbps
• A-MPDU and A-MSDU aggregation
• 0.4 µs guard interval support
• Center frequency range of operating channel: 2412 ~ 2484 MHz

Bluetooth®

• Bluetooth V4.2 BR/EDR and Bluetooth LE specification 1.2 Description
• Class-1, class-2 and class-3 transmitter
• AFH
• CVSDand SBC

Hardware

• Interfaces: ADC, DAC, touch sensor, SD/SDIO/MMC Host Controller, SPI, SDIO/SPI Slave Controller, EMAC, motor PWM, LED PWM, UART, I2C, I2S, infrared remote controller, GPIO, pulse counter
• 40MHzcrystal oscillator
• 8MBSPIflash
• Operating voltage/Power supply: 3.0 ~ 3.6 V
• Operating temperature range:–40 ~ 85 °C
• Dimensions: (7 × 7 × 1.11) mm

 

Where to use ESP32 Wi-Fi & Bluetooth MCU

The ESP32 at the heart of the package has a Tensilica Xtensa dual-core 32-bit LX6 microprocessor, with 448KB of ROM and 520KB of SRAM (including 8KB of RTC memory), and a 1KB eFuse. The SIP module integrates 4MB of SPI Flash memory, although as the ESP32 can support up to 16MB it’s possible we might see that in future revisions. Wireless connectivity support is 802.11 b/g/n/e/i (802.11n up to 150 Mbps), alongside Bluetooth V4.2 (BR/EDR and Bluetooth LE support).

The module interfaces include an SD card, UART, SPI, SDIO, LED PWM, Motor PWM, I2S, I2C, IR, as well as GPIO, capacitive touch sensor, ADC, DAC, and an LNA pre-amplifier. The chip also has two onboard sensors—a Hall sensor to detect magnetic fields, and a temperature sensor. Its small footprint and reduced number of external components make it perfectly suited for wearables and other Internet of Things devices.

Note: Complete technical details can be found in the ESP32-PICO-D4 datasheet at this page’s end.

 

ESP32-PICO-D4 Module Schematics

The schematics below show the internal schematics of ESP32-PICO-D4 SIP.

 

How To Use ESP32-PICO-D4 SIP?

This is the typical application circuit of the SiP connected with peripheral components (for example, power supply, antenna, reset button, JTAG interface, and UART interface).

 

Applications

• Generic Low-power IoT Sensor Hub
• Generic Low-power IoT Data Loggers
• Cameras for Video Streaming
• Over-the-top (OTT) Devices
• Speech Recognition
• Image Recognition
• Mesh Network
• Home Automation
• Smart Building
• Industrial Automation
• Smart Agriculture
• Audio Applications
• Health Care Applications
• Wi-Fi-enabled Toys
• Wearable Electronics
• Retail & Catering Applications

 

2D-Model and Dimensions

If you are designing a PCB or Perf board with this component, then the following picture from the Datasheet will be useful to know its package type and dimensions.